Telecoms Infrastructure Blog

OCTOBER 9, 2023

Last year, tech giants including Intel, Meta, Arm, Google Cloud, AMD, Qualcomm, TSMC and ASE formed the Chiplet consortium. A news article in Fierce Electronics said: Several giant tech companies have joined hands to promote an open standard for chip components called chiplets and how they are crammed together in system-on-chip (SoC) designs deemed critical to a variety of future handheld and high-performance computers that power AI applications and much more.

Cramming 52

Cramming Network Manufacturing Telecoms 52

Telecom Industry Association

OCTOBER 9, 2023

Fireside Chat @ INCOMPAS SHOW: Chip Pickering, CEO INCOMPA and Dave Stehlin, CEO TIA We are excited to share that our CEO, Dave Stehlin, recently engaged in a thought-provoking conversation… The post Risk and Reward: A Look at the Future of AI in Communications appeared first on TIA Online.

Communication 52

Communication 52

Get VoIP

OCTOBER 9, 2023

Summary: Vonage is a flexible business communications platform that combines a cloud-based phone system with team messaging and video conferencing.

Video conferencing 52

Video conferencing Phone Platform Communication 52

Get VoIP

OCTOBER 9, 2023

International VoIP calling is essential for businesses serving customers in multiple locations. It helps reduce call costs, offers mobility and.

Mobile 52

Mobile Unified Communications Communication 52