Mon.Oct 09, 2023

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Data Centers At Meta: Heterogeneous Integration Driven By AI/ML And Network Applications

Telecoms Infrastructure Blog

Last year, tech giants including Intel, Meta, Arm, Google Cloud, AMD, Qualcomm, TSMC and ASE formed the Chiplet consortium. A news article in Fierce Electronics said: Several giant tech companies have joined hands to promote an open standard for chip components called chiplets and how they are crammed together in system-on-chip (SoC) designs deemed critical to a variety of future handheld and high-performance computers that power AI applications and much more.

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Risk and Reward: A Look at the Future of AI in Communications

Telecom Industry Association

Fireside Chat @ INCOMPAS SHOW: Chip Pickering, CEO INCOMPA and Dave Stehlin, CEO TIA We are excited to share that our CEO, Dave Stehlin, recently engaged in a thought-provoking conversation… The post Risk and Reward: A Look at the Future of AI in Communications appeared first on TIA Online.

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Ooma vs Vonage: Which Is Better for Your Business?

Get VoIP

Summary: Vonage is a flexible business communications platform that combines a cloud-based phone system with team messaging and video conferencing.